{"id":66909,"date":"2023-09-29T14:24:21","date_gmt":"2023-09-29T18:24:21","guid":{"rendered":"https:\/\/ifintechworld.com\/news\/what-does-ai-and-euv-mean-for-asml-nasdaqasml\/"},"modified":"2023-09-29T14:24:25","modified_gmt":"2023-09-29T18:24:25","slug":"what-does-ai-and-euv-mean-for-asml-nasdaqasml","status":"publish","type":"post","link":"https:\/\/ifintechworld.com\/?p=66909","title":{"rendered":"What Does AI And EUV Mean For ASML? (NASDAQ:ASML)"},"content":{"rendered":"<div data-test-id=\"content-container\">\n<p><figure class=\"getty-figure\" data-type=\"getty-image\"><picture>  <\/picture><figcaption> <\/figcaption><\/figure>\n<\/p>\n<p>Key upstream components of the broader semiconductor value chain, such as equipment makers like ASML (<span class=\"ticker-hover-wrapper\">NASDAQ:ASML<\/span>) and fabs like TSMC (TSM), have yet to benefit as much from the emergence of AI momentum in<span class=\"paywall-full-content invisible\"> the market. And this is largely due to the slimmer margins and ensuing cash flows that result from the capital-intensive, yet mission-critical, business models. This also explains why these stocks are typically more prone to adverse headlines concerning the broader semiconductor industry, such as <\/span>cyclical challenges<span class=\"paywall-full-content invisible\">, <\/span>geopolitical headwinds<span class=\"paywall-full-content invisible\">, and regulatory constraints.<\/span><\/p>\n<p class=\"paywall-full-content invisible\">But ASML remains the leader in critical chipmaking equipment and is an essential enabler of key next-generation technologies such as AI. Its proprietary extreme ultraviolet, or \u201cEUV\u201d system is the backbone to propelling scale in the pursuit of high performance and high complexity advancements in microchip technology. Between ASML, EUV, and AI, the common thread is that they represent some<span class=\"paywall-full-content no-summary-bullets invisible\"> of the most expensive abbreviations in the world, as they entail long-term growth opportunities for industries beyond tech.<\/span><\/p>\n<p class=\"paywall-full-content invisible no-summary-bullets\">Despite recent concerns that demand for ASML\u2019s EUV systems might come in weaker than expected next year \u2013 which has triggered a brief immediate pullback in the stock, consistent with the name\u2019s sensitivity to any and all fundamental-impacting semiconductor headlines \u2013 the company\u2019s long-term moat remains intact. With the stock still largely trading below its semiconductor peer group average \u2013 and reasonably so given the sector\u2019s massive premium attributable to lofty AI profit margins that ASML only benefits partially from due to its capital-intensive business model \u2013 we believe there is room for more durable upside realization over the longer-term, sustained by the company\u2019s advantage in being the sole provider of some of the most mission-critical equipment in the industry.<\/p>\n<h2 class=\"paywall-full-content invisible no-summary-bullets\"><strong>What is EUV?<\/strong><\/h2>\n<p class=\"paywall-full-content invisible no-summary-bullets\">ASML credits EUV as the technology that enables the mass production of increasingly advanced microchips. EUV lithography uses a \u201cwavelength of just 13.5nm\u201d, enabling the production of increasingly advanced and complex chips fitted with billions of tiny transistors at scale. EUV lithography is behind the highly competitive race in introducing finer process nodes, including TSMC\u2019s most advanced 7nm, 4nm and 3nm process nodes used in manufacturing Nvidia\u2019s (NVDA) existing H100 and A100 GPUs optimized for AI workloads, as well as the next-generation B100 GPUs shipping in late 2024. ASML\u2019s EUV lithography system is also used in Intel\u2019s (INTC) \u201cIntel 4\u201d process node, which the next-generation Meteor Lake CPUs shipping later this year are manufactured on.<\/p>\n<p class=\"paywall-full-content invisible no-summary-bullets\">As previously discussed, increasingly fine process nodes are becoming critical in supporting the development of higher performance and more power efficient semiconductor technologies \u2013 hence ASML\u2019s allusion to EUV as the system that \u201cdrives Moore\u2019s Law forward\u201d. Specifically, Moore\u2019s Law stipulates that the number of transistors fitted in a chip will double every two years. However, the limitations are increasing as technologies become more advanced and complex, making it increasingly difficult to uphold the performance improvement timeline stipulated in Moore\u2019s Law. This has accordingly unleashed a series of complementary innovations and theories in recent years to extend the relevance of Moore\u2019s Law, including the introduction of new processes like \u201c3D Chip Stacking\u201d; innovations like Intel\u2019s transition from the nanometer to Intel puts TSMC on notice with step towards Angstrom era chips era with \u201cIntel 18A\u201d and \u201cIntel 20A\u201d; chipmaking equipment enhancements like ASML\u2019s EUV lithography systems; as well as the extension beyond hardware improvements to complementary features of a full stack process inclusive of software and AI capabilities, as preached by Nvidia CEO Jensen Huang.<\/p>\n<p class=\"paywall-full-content invisible no-summary-bullets\">Circling back to EUV \u2013 by using a 13.5nm wavelength (for perspective, a human red blood cell is 7,000nm in diameter), ASML\u2019s EUV lithography systems allow packing more performance into microchip architectures at scale, which is critical for chipmakers and only practical for facilitating the continued development and deployment of advanced semiconductor technologies. Think of the recent innovations by chipmakers like Nvidia, Intel and AMD (AMD). Each new generation of their GPU, CPU, and accelerator architectures require packing more transistors to make the hardware \u201cmore powerful, faster and energy efficient\u201d, hence the never-ending competition on refining process nodes among chip foundries, all of which are dependent on ASML\u2019s EUV system.<\/p>\n<p class=\"paywall-full-content invisible no-summary-bullets\">By being the only maker of EUV technology in the world, ASML benefits from a tremendous first-mover advantage in the digital era heavily reliant on microchip advancements. As mentioned in the earlier section, increasingly complex chips required for massive AI and other high-performance computing workloads rely on EUV lithography. This underscores a significant market opportunity for ASML and reinforces its role as the backbone of next-generation growth technologies. And this moat is reflected in its pricing power and sustained demand.<\/p>\n<p class=\"paywall-full-content invisible no-summary-bullets\">Specifically, on the demand front, ASML\u2019s monopoly in EUV lithography capitalizes on next-generation manufacturing requirements from key chipmaking fabs like TSMC and benefits from the recent slew of investments into new chip production capacities beyond Asia. Meanwhile, on the pricing front, the small volume of EUV systems deployed to date due to the consolidated fabrication industry footprint and complex manufacturing process of the lithography system itself also commands a hefty price tag. For context, since the inaugural shipment of ASML\u2019s first-generation \u201cEUV lithography demo tool\u201d in 2006, the company didn&#8217;t celebrate the shipment of the machine\u2019s 100<sup>th<\/sup> unit until 2020. The system goes for hundreds of millions of dollars for one unit, highlighting the capital-intensity to making the machine, as well as the premium that ASML\u2019s proprietary system commands \u2013 the MSRP from early 2022 was around $150 million per unit on the standard 0.33 numerical aperture, or \u201cNA\u201d, system, and could go as high as $321 million a pop for the upcoming 0.55 \u201cHigh-NA EXE\u201d variant.<\/p>\n<blockquote class=\"paywall-full-content invisible no-summary-bullets\">\n<p>We spent 20 years developing EUV with our partners and suppliers, resulting in a machine that contains around 100,000 parts. To ship just one of these huge machines to customers requires 40 freight containers, three cargo planes and 20 trucks.<\/p>\n<p><em>Source: Busting ASML myths, asml.com<\/em><\/p>\n<\/blockquote>\n<p class=\"paywall-full-content invisible no-summary-bullets\">Drilling a little further into ASML\u2019s next-generation High-NA EUV lithography system. The company is not without its competitors. Key competitor Applied Materials (AMAT) has recently introduced a new technology dubbed \u201cCentura Sculpta\u201d, which effectively reduces the costs of chip manufacturing by addressing the redundancies in some of the previously required EUV lithography processes. Instead of a substitute for EUV technology, Applied Materials credits Centura Sculpta as a complement effective in helping chipmakers realize greater cost-savings in the manufacturing process while also reducing waste and improving output efficiency.<\/p>\n<p class=\"paywall-full-content invisible no-summary-bullets\">To ensure it is not falling behind in matching said improvements, ASML has relentlessly worked on next-generation variants of its proprietary EUV lithography technology, including the High-NA platform \u201cEXE\u201d that has recently shipped its \u201cfirst pilot\u201d. The High-NA EXE platform is designed to facilitate scale in chip manufacturing advancements \u201cwell into the next decade\u201d, including support for the \u201c2nm logic node and followed by memory nodes at similar density\u201d. High volume chip production utilizing the High-NA EXE platform is expected to start in 2025.<\/p>\n<h2 class=\"paywall-full-content invisible no-summary-bullets\"><strong>A Potential Cut in 2024 Volumes<\/strong><\/h2>\n<p class=\"paywall-full-content invisible no-summary-bullets\">The latest news on the street is that ASML could potentially be in the position to cut its EUV delivery volumes for 2024. The dire expectations come from observations of weaker than expected end-market demand for advanced semiconductors, such as Apple\u2019s (AAPL) 3nm-based A17 silicon currently used in the iPhone 15 Pro line-up, as well as its upcoming M3 chip that will be used in powering the next-generation line-up of Macs and iPads. This is in line with the lingering aftermath of the chip inventory glut that has led to the cyclical downturn experienced over the past 12 months, which has been exacerbated by a weak consumer spending environment that has impacted shipments of PCs and smartphones.<\/p>\n<p class=\"paywall-full-content invisible no-summary-bullets\">There are also concerns that the slow phase-out of a location-agnostic work environment implemented during the pandemic could impact demand for portable computing devices such as laptops and iPads, which will reduce the need for \u201cApple silicon and Mini-led features\u201d reliant on fine process nodes enabled by EUV lithography. Limited exposure to demand for advanced chips from China \u2013 the largest semiconductor market \u2013 due to ongoing geopolitical tensions and restrictive national security policies implemented by Beijing and Washington has also been cited in the report as a potential limitation on the near-term need for EUV systems from fabs.<\/p>\n<h2 class=\"paywall-full-content invisible no-summary-bullets\"><strong>Near-Term Implications for the Stock<\/strong><\/h2>\n<p class=\"paywall-full-content invisible no-summary-bullets\">However, we see these concerns as a short-sighted view and unlikely to materially alter the prospects of ASML\u2019s cash flows, or its stock\u2019s upside potential. Much of ASML\u2019s volumes are locked-in by long-term supply contracts, providing a high level of visibility into its growth and profit trajectory.<\/p>\n<p class=\"paywall-full-content invisible no-summary-bullets\">For instance, Intel had placed orders for ASML\u2019s EUV systems in early 2022 in anticipation of the start of production of its Intel 4-based Meteor Lake this year. The chipmaker \u201ctook delivery of its first EUV lithography system\u201d in late 2022 at its Ireland fab. The machines are key to Intel\u2019s 4 nodes and 5-year technology roadmap stipulated in its IDM 2.0 turnaround strategy, with EUV lithography viewed as a critical link in putting Intel back on the map as a competitive chipmaker and manufacturer by 2025. ASML has also disclosed reservations for its next-generation High-NA EXE EUV systems from more than a year ago, even though commercial shipments are not expected until mid-decade. Takers include TSMC, which will likely be needing these machines to facilitate its global footprint expansion over the coming years. And all of this remains intact, whether Apple will generate sufficient demand in the near-term or not.<\/p>\n<p class=\"paywall-full-content invisible no-summary-bullets\">Near-term cyclical headwinds are not expected to have as much of a lasting impact on ASML\u2019s cash flow prospects as compared to chipmakers situated lower in the semiconductor value change given their direct exposure to fluctuations in end-market demand. Admittedly, any adverse impact to guidance could impact the stock\u2019s near-term performance, especially given the elevated cost of the capital environment which bodes unfavourably for capital-intensive business models like ASML\u2019s, despite the company\u2019s sustained growth and profit trajectory backed by its mission-critical technology moat.<\/p>\n<p class=\"paywall-full-content invisible no-summary-bullets\">We also view any near-term impacts to EUV shipments would be merely a shift in timing due to the weaker than expected cyclical recovery. While the industry had previously expected the chip inventory glut to normalize in 2H23, recent commentary from the latest earnings season from PC and chipmakers have highlighted a more tepid pace of recovery than expected, though the correction cycle and slow shipments have likely troughed in Q1. Such an occurrence of tepid recovery through the remainder of the year is reasonably expected, considering the economic outlook is still a \u201cmixed bag\u201d, especially with monetary policy likely to normalize into a more restrictive set-up.<\/p>\n<p class=\"paywall-full-content invisible no-summary-bullets\">But longer-term tailwinds for ASML include the build-out of domestic manufacturing capacities, which is not stopping now and will harbinger a requirement for new equipment including the EUV systems to facilitate long-term demand for next-generation chips. This also precedes an anticipated upgrade cycle to support next-generation HPC and AI chip architectures for addressing computing demands of increasingly complex workloads. More importantly, ASML is a key enabler of these technologies, underpinning its long-term growth and profit prospects. While any near-term underperformance or under delivery to guidance could drive volatility in the stock, ASML remains a name we\u2019d like to add to partake in its longer-term upside potential.<\/p>\n<p class=\"paywall-full-content invisible no-summary-bullets\">Editor&#8217;s Note: This article discusses one or more securities that do not trade on a major U.S. exchange. Please be aware of the risks associated with these stocks.<\/p>\n<\/div>\n<p>Read the full article <a href=\"https:\/\/seekingalpha.com\/article\/4638165-what-ai-and-euv-mean-for-asml?source=feed_all_articles\" target=\"_blank\" rel=\"noopener\">here<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Key upstream components of the broader semiconductor value chain, such as equipment makers like ASML (NASDAQ:ASML) and fabs like TSMC (TSM), have yet to benefit as much from the emergence of AI momentum in the market. And this is largely due to the slimmer margins and ensuing cash flows that result from the capital-intensive, yet [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":66910,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"gallery","meta":{"footnotes":""},"categories":[236],"tags":[83],"class_list":["post-66909","post","type-post","status-publish","format-gallery","has-post-thumbnail","hentry","category-news","tag-featured","post_format-post-format-gallery"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v20.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>What Does AI And EUV Mean For ASML? (NASDAQ:ASML) | iFintechWorld<\/title>\n<meta name=\"description\" content=\"Key upstream components of the broader semiconductor value chain, such as equipment makers like ASML (NASDAQ:ASML) and fabs like TSMC (TSM), have yet to\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/ifintechworld.com\/?p=66909\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"What Does AI And EUV Mean For ASML? 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(NASDAQ:ASML)\",\"datePublished\":\"2023-09-29T18:24:21+00:00\",\"dateModified\":\"2023-09-29T18:24:25+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/ifintechworld.com\/?p=66909\"},\"wordCount\":1920,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\/\/ifintechworld.com\/#organization\"},\"keywords\":[\"Featured\"],\"articleSection\":[\"News\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\/\/ifintechworld.com\/?p=66909#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/ifintechworld.com\/?p=66909\",\"url\":\"https:\/\/ifintechworld.com\/?p=66909\",\"name\":\"What Does AI And EUV Mean For ASML? (NASDAQ:ASML) | iFintechWorld\",\"isPartOf\":{\"@id\":\"https:\/\/ifintechworld.com\/#website\"},\"datePublished\":\"2023-09-29T18:24:21+00:00\",\"dateModified\":\"2023-09-29T18:24:25+00:00\",\"description\":\"Key upstream components of the broader semiconductor value chain, such as equipment makers like ASML (NASDAQ:ASML) and fabs like TSMC (TSM), have yet to\",\"breadcrumb\":{\"@id\":\"https:\/\/ifintechworld.com\/?p=66909#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/ifintechworld.com\/?p=66909\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/ifintechworld.com\/?p=66909#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/ifintechworld.com\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"What Does AI And EUV Mean For ASML? (NASDAQ:ASML)\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/ifintechworld.com\/#website\",\"url\":\"https:\/\/ifintechworld.com\/\",\"name\":\"Repay Down\",\"description\":\"Latest Personal Finance News, Tips and Updates\",\"publisher\":{\"@id\":\"https:\/\/ifintechworld.com\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/ifintechworld.com\/?s={search_term_string}\"},\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/ifintechworld.com\/#organization\",\"name\":\"Repay Down\",\"url\":\"https:\/\/ifintechworld.com\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/ifintechworld.com\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/ifintechworld.com\/wp-content\/uploads\/2023\/04\/rep-logo-dark.png\",\"contentUrl\":\"https:\/\/ifintechworld.com\/wp-content\/uploads\/2023\/04\/rep-logo-dark.png\",\"width\":558,\"height\":90,\"caption\":\"Repay Down\"},\"image\":{\"@id\":\"https:\/\/ifintechworld.com\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/ifintechworld.com\/#\/schema\/person\/6224724fd4116361255b179dc5c70b61\",\"name\":\"News Room\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/ifintechworld.com\/#\/schema\/person\/image\/\",\"url\":\"https:\/\/ifintechworld.com\/wp-content\/uploads\/2023\/04\/avatar_user_1_1682606986-96x96.png\",\"contentUrl\":\"https:\/\/ifintechworld.com\/wp-content\/uploads\/2023\/04\/avatar_user_1_1682606986-96x96.png\",\"caption\":\"News Room\"},\"sameAs\":[\"https:\/\/ifintechworld.com\"],\"url\":\"https:\/\/ifintechworld.com\/?author=1\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"What Does AI And EUV Mean For ASML? (NASDAQ:ASML) | iFintechWorld","description":"Key upstream components of the broader semiconductor value chain, such as equipment makers like ASML (NASDAQ:ASML) and fabs like TSMC (TSM), have yet to","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/ifintechworld.com\/?p=66909","og_locale":"en_US","og_type":"article","og_title":"What Does AI And EUV Mean For ASML? (NASDAQ:ASML) | iFintechWorld","og_description":"Key upstream components of the broader semiconductor value chain, such as equipment makers like ASML (NASDAQ:ASML) and fabs like TSMC (TSM), have yet to","og_url":"https:\/\/ifintechworld.com\/?p=66909","og_site_name":"iFintechWorld","article_published_time":"2023-09-29T18:24:21+00:00","article_modified_time":"2023-09-29T18:24:25+00:00","og_image":[{"width":1536,"height":1024,"url":"https:\/\/ifintechworld.com\/wp-content\/uploads\/2023\/09\/1696011863_image_1184085814.jpg","type":"image\/jpeg"}],"author":"News Room","twitter_card":"summary_large_image","twitter_misc":{"Written by":"News Room","Est. reading time":"10 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/ifintechworld.com\/?p=66909#article","isPartOf":{"@id":"https:\/\/ifintechworld.com\/?p=66909"},"author":{"name":"News Room","@id":"https:\/\/ifintechworld.com\/#\/schema\/person\/6224724fd4116361255b179dc5c70b61"},"headline":"What Does AI And EUV Mean For ASML? (NASDAQ:ASML)","datePublished":"2023-09-29T18:24:21+00:00","dateModified":"2023-09-29T18:24:25+00:00","mainEntityOfPage":{"@id":"https:\/\/ifintechworld.com\/?p=66909"},"wordCount":1920,"commentCount":0,"publisher":{"@id":"https:\/\/ifintechworld.com\/#organization"},"keywords":["Featured"],"articleSection":["News"],"inLanguage":"en-US","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/ifintechworld.com\/?p=66909#respond"]}]},{"@type":"WebPage","@id":"https:\/\/ifintechworld.com\/?p=66909","url":"https:\/\/ifintechworld.com\/?p=66909","name":"What Does AI And EUV Mean For ASML? (NASDAQ:ASML) | iFintechWorld","isPartOf":{"@id":"https:\/\/ifintechworld.com\/#website"},"datePublished":"2023-09-29T18:24:21+00:00","dateModified":"2023-09-29T18:24:25+00:00","description":"Key upstream components of the broader semiconductor value chain, such as equipment makers like ASML (NASDAQ:ASML) and fabs like TSMC (TSM), have yet to","breadcrumb":{"@id":"https:\/\/ifintechworld.com\/?p=66909#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/ifintechworld.com\/?p=66909"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/ifintechworld.com\/?p=66909#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/ifintechworld.com\/"},{"@type":"ListItem","position":2,"name":"What Does AI And EUV Mean For ASML? (NASDAQ:ASML)"}]},{"@type":"WebSite","@id":"https:\/\/ifintechworld.com\/#website","url":"https:\/\/ifintechworld.com\/","name":"Repay Down","description":"Latest Personal Finance News, Tips and Updates","publisher":{"@id":"https:\/\/ifintechworld.com\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/ifintechworld.com\/?s={search_term_string}"},"query-input":"required name=search_term_string"}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/ifintechworld.com\/#organization","name":"Repay Down","url":"https:\/\/ifintechworld.com\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/ifintechworld.com\/#\/schema\/logo\/image\/","url":"https:\/\/ifintechworld.com\/wp-content\/uploads\/2023\/04\/rep-logo-dark.png","contentUrl":"https:\/\/ifintechworld.com\/wp-content\/uploads\/2023\/04\/rep-logo-dark.png","width":558,"height":90,"caption":"Repay Down"},"image":{"@id":"https:\/\/ifintechworld.com\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/ifintechworld.com\/#\/schema\/person\/6224724fd4116361255b179dc5c70b61","name":"News Room","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/ifintechworld.com\/#\/schema\/person\/image\/","url":"https:\/\/ifintechworld.com\/wp-content\/uploads\/2023\/04\/avatar_user_1_1682606986-96x96.png","contentUrl":"https:\/\/ifintechworld.com\/wp-content\/uploads\/2023\/04\/avatar_user_1_1682606986-96x96.png","caption":"News Room"},"sameAs":["https:\/\/ifintechworld.com"],"url":"https:\/\/ifintechworld.com\/?author=1"}]}},"amp_enabled":true,"_links":{"self":[{"href":"https:\/\/ifintechworld.com\/index.php?rest_route=\/wp\/v2\/posts\/66909","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ifintechworld.com\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ifintechworld.com\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ifintechworld.com\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ifintechworld.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=66909"}],"version-history":[{"count":1,"href":"https:\/\/ifintechworld.com\/index.php?rest_route=\/wp\/v2\/posts\/66909\/revisions"}],"predecessor-version":[{"id":66911,"href":"https:\/\/ifintechworld.com\/index.php?rest_route=\/wp\/v2\/posts\/66909\/revisions\/66911"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/ifintechworld.com\/index.php?rest_route=\/wp\/v2\/media\/66910"}],"wp:attachment":[{"href":"https:\/\/ifintechworld.com\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=66909"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ifintechworld.com\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=66909"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ifintechworld.com\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=66909"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}